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High Density Interconnect HDI PCB Board 1.8mm Thickness 12 Layer

Abis Circuits Co., Ltd.
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High Density Interconnect HDI PCB Board 1.8mm Thickness 12 Layer

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Brand Name : ABIS

Model Number : HDI-6

Certification : UL, ISO9001,ISO14001,SGS,RoHS, TS16949

Place of Origin : China

MOQ : 1pcs

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal

Supply Ability : 60,000 s.q.m/month

Delivery Time : 0.5-4 week

Packaging Details : Vacuum packing

Material : FR4 Tg170

Layers : 12 layer

App : Communication

Copper thick : 3OZ

Buried vias : Yes

Via plug : Yes

Surface treatment : ENIG 3u''

Board thickness : 1.8mm

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High Density Interconnect PCB Board Manufacturing


1. 12 layer hdi board with ENIG 3u''.

2. FR4 Tg170 clad.

3. Communication application.

4. Blind/Buried via and via plug.

5. 0.075mm line trace and space.



High Density Interconnect HDI PCB Board 1.8mm Thickness 12 Layer

1 Layers 12 layer
2 Material FR4 tg170
3 Board thick 1.8mm
4 Usage Communication
5 Laser drill size 0.1mm
6 Min line trace 0.075mm
7 Min space 0.075mm
8 Surface treatment ENIG 3u''
9 Copper thick 105um
10 Solder mask thick 10-30um
11 Buried via Yes
12 Via plug Yes
13 Certificates UL,ISO,RoHS,SGS

FAQ

Q1:HDI means?
A: High density Interconnect.

Q2:How to judge HDI board?
A: Stack up or drill files
.

Q3:How to ensure the quality?
A: All boards test ok before shipment.

Q4: How about the lead time?
A: About HDI PCB,our lead time is 4weeks.

Q5: Which products will use it?
A: Mobile,Imaging system
,defense system etc.

Q6: What about your certs?
A: ISO9001/14001/16949,UL,RoHS,SGS.

Factory building:

High Density Interconnect HDI PCB Board 1.8mm Thickness 12 Layer


High Density Interconnect HDI PCB Board 1.8mm Thickness 12 Layer


Product Tags:

High Density HDI PCB Board

      

Interconnect HDI PCB Board

      

1.8mm Thickness Fr4 Pcb Board

      
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